The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions.

Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...

Grinn has launched a credit card-sized SBC powered by its MediaTek Genio 510 or Genio 700 Cortex-A78/A55 SoM, and designed ...

So far, if you wanted to evaluate Renesas RA8P1 Cortex-M85 MCU clocked at 1 GHz, you had to spend close to $200 to get the EK ...

Abstract: In the 3D ferroelectric memory fabrication process, the outer Titanium nitride metal electrode and silicon doped hafnium-based ferroelectric layer will produce void defects at the interfaces ...

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