The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...
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