Using PGA chip packages is one of several choices when deciding how to attach a chip to a pc board. Socketing the processor rather than permanently soldering it to the board has some obvious ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...