Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).

Power management has received increasing focus in microelectronic systems as the need for greater power density, efficiency and precision have grown apace. One of the important ongoing trends in ...

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...