Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...
SHOPS MAY SOON DITCH CLUMSY fasteners and replace them with a new high-strength, electrically disbonding adhesive called ElectRelease. The epoxy bonds together metal substrates and withstands shear ...
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