TL;DR: TSMC plans to increase prices for its 5nm and 3nm process nodes by 5-10% and CoWoS advanced packaging by 15-20% due to high AI demand. These price hikes are expected in January 2025. The 3nm ...
TAIPEI, Taiwan--(BUSINESS WIRE)--TrendForce reports that the three largest DRAM suppliers are increasing wafer input for advanced processes. Following a rise in memory contract prices, companies have ...
In January 2025, while the global AI and semiconductor industries remained focused on advanced process nodes and high-performance GPUs, China's large-scale model DeepSeek-R1 emerged... As artificial ...
Optimising industrial processes is essential for enhancing efficiency, reducing costs, and ensuring sustainability. Advanced analytical solutions play a crucial role in achieving these objectives by ...
Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes
AI-driven design solution enables circuit optimization, saving weeks of manual and iterative effort while increasing design quality. Interoperable process design kits for all advanced TSMC FinFET ...
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